JU-R2S has been newly developed to cope with the higher demands of the lead free process. Under the conditions of the lead free reflow profile (Pre-heat temp. : 180 -190°C for 120sec / at 220°C or above for 20~30sec), this adhesive does not inhibit the self-alignment effect of lead free solder, ensuring good solderability (without creating lift-off of QFP leads from the PCB) and works as an adhesive to fix large electronic components onto PCBs. In the second reflow process, the adhesive is completely cured and prevents both drop and dislocation of mounted components on the PCB.

JU-R2SDownload PDF File: (1,373KB)