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  Lead free - No-clean solder pastes
  Lead free - No-clean wave soldering fluxes
  Lead free - No-clean flux cored wire solders
  Lead free - SMT adhesive JU-R2S
  Lead containing - No-clean solder pastes
  Lead containing - No-clean wave soldering fluxes
  Lead containing - No-clean flux cored wire solder JM-20
  Lead containing - SMT adhesives
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Contact person: Mr.Hu
Tel: 0411-87300505
Fax:0411-87305556
Mobile: 13940906200
E-mail: fenghu@chjtech.com
Factory Address:
NO.5,HuaiheRiverthreegroups,
Economicdevelopmentzone,Dalian

 
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Lead containing - SMT adhesives
 
 

A range of epoxy based adhesives ensures extremely stable hi-speed dispensability whilst significantly improving bonding strength.
Adhesives suitable for low curing temperature and printing applications are also available

Download PDF File:

 

 

 

Product Composition Viscosity (Pa.S) Application Pdf
JU-100-5

Epoxy

50.0

General purposes
Dispensing

PDF icon
(261KB)
JU-95 80.0

Low temperature curable Dispensing

PDF icon
(500KB)
JU-41P 100.0

General purposes
Printing

PDF icon
(393KB)
JU-44P 82.0

General purposes
Printing

 
 
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